• Simulation und Berechnung elektromagnetischer Felder
• EMV (Leiterplatte und Leistungselektronik)

Orginalartikel in Kongressbänden

Seyfried, D.; Bednarz, C.; Friedrich, M.: Lumped Circuit Model for Concentrically Arranged Conductors in Power Electronic Systems. In: International Symposium on Electromagnetic Compatibility (EMC Europe), Gothenburg, 2022, S. 1 – 6

Amende,T.; Friedrich, M.; Endres, M. Pihale, S.; Schmidt, R. : Thermal conductivity of Al2O3 substrates and precise 3D layer reconstruction - key parameters for matching FEM simulations with thermal measurements In: CIPS 2016, Nürnberg, 2016

Friedrich, M.; Bednarz, C.; Leone, M.: Neuartige Randintegralmethode zur Berechnung der Portinduktivitäten in planparallelen Plattenstrukturen In: EMV 2016, Düsseldorf, 2016 (Internationale Fachmesse und Kongress für Elektromagnetische Verträglichkeit)

Baum,E.; Friedrich, M.; Mrozynski, S.: Transient Field Solution for Transformer with Axial Symmetry - Capacative Loaded Secondary In: Proceedings of the 17th International Symposium on Electromagnetic Fields in Mechatronics, Electrical and Electronic Engineering, ISEF-2015, Valencia, CD-Proceedings

Friedrich, M.; Bednarz, C.; Leone, M.: Ersatzschaltbilddarstellung von EBG-Filterstrukturen auf Leiterplatten In: EMV 2014, Düsseldorf, 2014 (Internationale Fachmesse und Kongress für Elektromagnetische Verträglichkeit),

Friedrich, M.; Bednarz, C.; Leone, M. : Exact Solution for Via-Plate Capacitances Including the Finite Plate Thickness. In: International Conference on Electromagnetics in Advanced Applications (ICEAA), Turin, 2013, S. 1 – 4

Friedrich, M.; Bednarz, C.; Leone, M.: Efficient Equivalent Circuit Representation of Electromagnetic Bandgap Structures. In: International Symposium on Electromagnetic Compatibility (EMC Europe), Brügge, 2013 , S. 1 – 5.

Friedrich, M.; Mantzke, A.; Leone, M.: Efficient finite-difference method with analytical port model for the analysis of power-plane applications. In: International Symposium on Electromagnetic Compatibility (EMC Europe), Rom, 2012, S. 1 – 6

Friedrich, M.; Leone, M.: Exact analytical analysis of via-coupling in multiple-layer structures. In: International Symposium on Electromagnetic Compatibility (EMC Europe), Rom, 2012, S. 1 – 5

Friedrich, M.; Leone, M.: Induktives Netzwerkmodell für die Signalintegritäts- und Abstrahlungsanalyse vertikaler Verbindungsstrukturen. In: EMV 2012, Düsseldorf, 2012 (Internationale Fachmesse und Kongress für Elektromagnetische Verträglichkeit), S. 429 – 436

Leone, M.; Friedrich, M.: Modeling the electromagnetic behavior of parallel-plane interconnections. In: International Conference on Electromagnetics in Advanced Applications (ICEAA), Turin , 2011, S. 1396 – 1399

Baum, E.; Friedrich, M. : Computation of Frequency Dependet Step-Up Factor for Coil Resistances In: Proceedings of the 15th International Symposium on Electromagnetic Fields in Mechatronics, Electrical and Electronic Engineering, ISEF-2011, Funchal, CD-Proceedings

Friedrich, M.; Mantzke, A.; Leone, M.: Network modeling of vertical signal interconnections in parallel reference plane structures on printed circuit boards. In: IEEE 14th Workshop on Signal Propagation on Interconnects (SPI), Hildesheim, 2010, S. 7 – 8

Friedrich, M.; Leone, M.: Network model for the analysis of radiated emissions from horizontal PCB submodules. In: IEEE International Symposium on Electromagnetic Compatibility (EMC), Fort Lauderdale, 2010, S. 631 – 636

Friedrich, M.; Stumpf, M.; Leone, M.: Effiziente 2-D Integralgleichungsmethode zur Analyse von Power-Bus Strukturen auf Leiterplatten. In: EMV 2010, Düsseldorf, 2010 (Internationale Fachmesse und Kongress für Elektromagnetische Verträglichkeit), S. 577 – 584

Friedrich, M.; Baum, E.; Riffer, H. : Efficient Computation of Coil Parameters with PEEC. In: Studies in Applied Electromagnetics and Mechanics, Vol. 34 (2010), S. 685 – 692

Orginalartikel in begutachteten internationalen Zeitschriften

Friedrich, M.; Leone, M.: Boundary-Element Method for the Calculation of Port Inductances in Parallel-Plane Structures. In: IEEE Transactions on Electromagnetic Compatibility, Vol. 56 (2014) Dez, Nr. 6, S. 1439 – 1447

Friedrich, M.; Bednarz, C.; Leone, M.: Improved Expression for the Via-Plate Capacitance Based on the Magnetic-Frill Model. In: IEEE Transactions on Electromagnetic Compatibility, Vol. 55 (2013) Dez, Nr. 6, S. 1362 – 1364

Leone, M.; Friedrich, M.; Mantzke, A.: Efficient Broadband Circuit-Modeling Approach for Parallel-Plane Structures of Arbitrary Shape. In: IEEE Transactions on Electromagnetic Compatibility on, Vol. (55) (2013), Okt., S. 941 – 948

Friedrich, M. ; Leone, M.: Quasi-Static Inductance of Vertical Interconnections in Parallel-Plane Structures. In: IEEE Transactions on Electromagnetic Compatibility, Vol. 54 (2012), Dez., Nr. 6, S. 1302 – 1305

Friedrich, M.; Leone, M.; Bednarz, C.: Exact Analytical Solution for the Via-Plate Capacitance in Multiple-Layer Structures. In: IEEE Transactions on Electromagnetic Compatibility, Vol. 54 (2012), Okt., Nr. 5, S. 1097 – 1104 

Friedrich, M.; Leone, M.: Inductive Network Model for the Radiation Analysis of Electrically Small Parallel-Plate Structures. In: IEEE Transactions on Electromagnetic Compatibility, Vol. 53 (2011), Nov., Nr. 4, S. 1015 – 1024