Prof. Dr. Matthias Friedrich
Studiendekan
Applied Electrical Engineering and Intelligent Systems
Fulda University of Applied Sciences
Building
33,
Room
318
Leipziger Straße 123
36037 Fulda
Consultation hours: Friday 13:30- 14:15 after prior registration by e-mail. At any time by appointment.
CV
Matthias Friedrich has been working at Fulda University of Applied Sciences in the Department of Electrical Engineering and Information Technology since October 2021.
He already studied Electrical Engineering & Information Technology at Fulda University of Applied Sciences from 2004 - 2008. From 2008 - 2014, he worked as a research assistant at the University of Magdeburg in the Department of Theoretical Electrical Engineering and completed his doctorate on the topic of high-frequency modelling of vertical interconnection structures between plane-parallel plate arrangements.
He then worked as a development engineer at Siemens eCar Powertrain Systems and from 2015 - 2019 at the EMC Centre at Siemens AG. Here, his focus was on the EMC of high-voltage direct current transmission systems (HVDC) and flexible AC transmission systems (FACTs).
From 2019 - 2021, Matthias Friedrich worked for the first time as a professor at the University of Applied Sciences Würzburg-Schweinfurt until he finally accepted the call to Fulda University of Applied Sciences in 2021.
Areas of Research
- Simulation and calculation of electromagnetic fields
- EMC (printed circuit board and power electronics)
Publications
Original articles in congress proceedings
Seyfried, D.; Bednarz, C.; Friedrich, M.: Lumped Circuit Model for Concentrically Arranged Conductors in Power Electronic Systems. In: International Symposium on Electromagnetic Compatibility (EMC Europe), Gothenburg, 2022, pp. 1 - 6.
Amende,T.; Friedrich, M.; Endres, M. Pihale, S.; Schmidt, R. : Thermal conductivity of Al2O3 substrates and precise 3D layer reconstruction - key parameters for matching FEM simulations with thermal measurements In: CIPS 2016, Nürnberg, 2016.
Friedrich, M.; Bednarz, C.; Leone, M.: Novel boundary integral method for the calculation of port inductances in plane-parallel plate structures In: EMV 2016, Düsseldorf, 2016 (International Trade Fair and Congress on Electromagnetic Compatibility)
Baum,E.; Friedrich, M.; Mrozynski, S.: Transient Field Solution for Transformer with Axial Symmetry - Capacative Loaded Secondary In: Proceedings of the 17th International Symposium on Electromagnetic Fields in Mechatronics, Electrical and Electronic Engineering, ISEF-2015, Valencia, CD-Proceedings
Friedrich, M.; Bednarz, C.; Leone, M.: Equivalent circuit representation of EBG filter structures on printed circuit boards In: EMV 2014, Düsseldorf, 2014 (International Trade Fair and Congress on Electromagnetic Compatibility),
Friedrich, M.; Bednarz, C.; Leone, M. : Exact Solution for Via-Plate Capacitances Including the Finite Plate Thickness. In: International Conference on Electromagnetics in Advanced Applications (ICEAA), Turin, 2013, pp. 1 - 4.
Friedrich, M.; Bednarz, C.; Leone, M.: Efficient Equivalent Circuit Representation of Electromagnetic Bandgap Structures. In: International Symposium on Electromagnetic Compatibility (EMC Europe), Bruges, 2013 , pp. 1 - 5.
Friedrich, M.; Mantzke, A.; Leone, M.: Efficient finite-difference method with analytical port model for the analysis of power-plane applications. In: International Symposium on Electromagnetic Compatibility (EMC Europe), Rome, 2012, pp. 1 - 6.
Friedrich, M.; Leone, M.: Exact analytical analysis of via-coupling in multiple-layer structures. In: International Symposium on Electromagnetic Compatibility (EMC Europe), Rome, 2012, pp. 1 - 5.
Friedrich, M.; Leone, M.: Inductive network model for signal integrity and radiation analysis of vertical interconnect structures. In: EMC 2012, Düsseldorf, 2012 (International Trade Fair and Congress on Electromagnetic Compatibility), pp. 429 - 436.
Leone, M.; Friedrich, M.: Modeling the electromagnetic behavior of parallel-plane interconnections. In: International Conference on Electromagnetics in Advanced Applications (ICEAA), Turin , 2011, pp. 1396 - 1399.
Baum, E.; Friedrich, M. : Computation of Frequency Dependet Step-Up Factor for Coil Resistances In: Proceedings of the 15th International Symposium on Electromagnetic Fields in Mechatronics, Electrical and Electronic Engineering, ISEF-2011, Funchal, CD-Proceedings.
Friedrich, M.; Mantzke, A.; Leone, M.: Network modeling of vertical signal interconnections in parallel reference plane structures on printed circuit boards. In: IEEE 14th Workshop on Signal Propagation on Interconnects (SPI), Hildesheim, 2010, pp. 7 - 8.
Friedrich, M.; Leone, M.: Network model for the analysis of radiated emissions from horizontal PCB submodules. In: IEEE International Symposium on Electromagnetic Compatibility (EMC), Fort Lauderdale, 2010, pp. 631 - 636.
Friedrich, M.; Stumpf, M.; Leone, M.: Efficient 2-D integral equation method for the analysis of power bus structures on printed circuit boards. In: EMC 2010, Düsseldorf, 2010 (International Trade Fair and Congress on Electromagnetic Compatibility), pp. 577 - 584
Friedrich, M.; Baum, E.; Riffer, H. : Efficient Computation of Coil Parameters with PEEC In: Studies in Applied Electromagnetics and Mechanics, Vol. 34 (2010), pp. 685 - 692
Original articles in peer-reviewed international journals
Friedrich, M.; Leone, M.: Boundary-Element Method for the Calculation of Port Inductances in Parallel-Plane Structures. In: IEEE Transactions on Electromagnetic Compatibility, Vol. 56 (2014) Dec, No. 6, pp. 1439 - 1447.
Friedrich, M.; Bednarz, C.; Leone, M.: Improved Expression for the Via-Plate Capacitance Based on the Magnetic-Frill Model. In: IEEE Transactions on Electromagnetic Compatibility, Vol. 55 (2013) Dec, No. 6, pp. 1362 - 1364.
Leone, M.; Friedrich, M.; Mantzke, A.: Efficient Broadband Circuit-Modeling Approach for Parallel-Plane Structures of Arbitrary Shape. In: IEEE Transactions on Electromagnetic Compatibility on, Vol. (55) (2013), Oct, pp. 941 - 948.
Friedrich, M. ; Leone, M.: Quasi-Static Inductance of Vertical Interconnections in Parallel-Plane Structures. In: IEEE Transactions on Electromagnetic Compatibility, Vol. 54 (2012), Dec., No. 6, pp. 1302 - 1305.
Friedrich, M.; Leone, M.; Bednarz, C.: Exact Analytical Solution for the Via-Plate Capacitance in Multiple-Layer Structures. In: IEEE Transactions on Electromagnetic Compatibility, Vol. 54 (2012), Oct, No. 5, pp. 1097 - 1104.
Friedrich, M.; Leone, M.: Inductive Network Model for the Radiation Analysis of Electrically Small Parallel-Plate Structures. In: IEEE Transactions on Electromagnetic Compatibility, Vol. 53 (2011), Nov., No. 4, pp. 1015 - 1024.